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Discrete Chips Integrated circuit

Automotive

Small Signal Switching Diode
Small Signal Schottky Diode
Small Signal Zener Diode
Small Signal Transisitor
SMD Rectifier Diode
Fast Recovery Rectifier Diode
SMD Schottky Diode
Transient Voltage Suppressor
ESD Protection Diode
Power MOS Transistor
Power Transistor
Small signal digital transistor
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SiC Automotive
IGBT Automotive

Rectifier

Bridge Rectifier
Standard Recovery Rectifier
Fast Recovery Rectifier
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Super Fast Recovery Rectifier
Schottky Barrier Rectifier
PV Diode
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Automotive Rectifier
Rectifier Diode Fast Recovery Rectifier Diode Schottky Diode

Protection Diode

Transient Voltage Suppressor
Thyristor Surge Suppressor
ESD Protection Diode
Zener Diode

Automotive Protection Diode
Transient Voltage Suppressor ESD Protection Diode Power Zener Diode

Small Signal

Small Signal Switching Diode
Small Signal Schottky Diode
Small Signal Zener Diode
Small Signal Transisitor
Small Signal Digital Transisitor
Power Transistor

Automotive Small Signal
Small Signal Switching Diode Small Signal Schottky Diode Small Signal Zener Diode Small Signal Transisitor Power Transistor Small Signal Digital Transisitor

MOSFET

ALL MOSFET
Automotive MOSFET

High-voltage MOSFET(500V-1000V)
SJ MOSFET SiC MOSFET

Low & Medium Voltage MOSFET(12V-400V)
N-Channel MOSFET P-Channel MOSFET

NP MOSFET(12V-300V)
Complementary MOSFET Dual N-Channel MOSFET Dual P-Channel MOSFET Half-bridge MOSFET

IGBT

IGBT Module
IGBT Discrete
IGBT Automotive

Module

Rectifier Diodes Module
Fast Recovery Module
Schottky Module
Thyristor Module
Thyristor / Rectifier Diode Module
Fast/Phase-controlled Thyristor

SiC

SiC Schottky
SiC MOSFET
SiC Automotive
SiC Schottky
Diode Modules
SiC MOSFET
Modules

4/5″wafer

STD Chip
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EPI Chip
TVS Chip
HVB High Voltage Module Chip
Automotive Electronics Chip

6″wafer

TSBD Chip
PSBD Chip
FRED Chip
LBD Chip
PMBD Chip
ESD Chip

Integrated circuit

LOAD Switches
LDO
Shunt Regulator
DC-DC

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CN EN

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SOD-123HE TVS Diode

SOD-123HE TVS Diode Back

PDF

Introduction 1.Withultra-thinpackageshape,itcanbeusedinminiaturizedandthincircuits；
2.Thebottom sideofthepackagehasaheatsink,whichhasexcellentheat
dissipationperformance；
3.Therearemanykindsofpackagingchips,includingGPP,DB,Schottky,FRED,
TVSandotherchips;
4.Theproductismadeofenvironment-friendlymaterialsandmeetsRoHSstandards;
5. Products are widely used in secondary rectifier circuits, converters, freewheeling diodes, AC/DC power protection and so on.

Features 1. Excellent heat dissipation performance: the back pad has large area, good heat dissipation performance and strong flow capacity, which can meet the requirements of high-temperature applications
2、Thin package shape ：the package shape is thinner than SOD-123FL package and meets the development trend of packaging thinness

SPECIFICATION

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